China Wafer Bare Die Tray Packaging  For Electronics Semiconductor Industry for sale
China Wafer Bare Die Tray Packaging  For Electronics Semiconductor Industry for sale
  1. China Wafer Bare Die Tray Packaging  For Electronics Semiconductor Industry for sale
  2. China Wafer Bare Die Tray Packaging  For Electronics Semiconductor Industry for sale
  3. China Wafer Bare Die Tray Packaging  For Electronics Semiconductor Industry for sale
  4. China Wafer Bare Die Tray Packaging  For Electronics Semiconductor Industry for sale

Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry

Price $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ 1000 pcs
Delivery Time 5~8 working days
Brand Hiner-pack
Place of Origin Made In China
Certification ISO 9001 ROHS SGS
Model Number HN2079
Packaging Details It depends on the QTY of order and size of product
Payment Terms T/T
Supply Ability 4000PCS~5000PCS/per day

Product Details

Product Specification

Place of Origin Made In China Size 2 Inch
Molding Method Injection Moulding Packaging Details It depends on the QTY of order and size of product
Color Black Material ABS
Injection Mold Lead Time 20~25Days, Mold Life Span: 30~450,000 Times Model Number HN2079
Supply Ability 4000PCS~5000PCS/per day Certification ISO 9001 ROHS SGS
Brand Name Hiner-pack Payment Terms T/T
Design Standard Price $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Delivery Time 5~8 working days Surface Resistance 1.0x10E4~1.0x10E11Ω
Minimum Order Quantity 1000 pcs Clean class General And Ultrasonic Cleaning
Incoterms EXW,FOB,CIF,DDU,DDP Property ESD

Product Description

Wafer Bare Die Tray Packaging  For Electronics Semiconductor Industry

IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).


An anti-static tray is an ideal tool for storing electronic components. Due to the addition of special polymer chains in the raw material, the finished product has permanent electrostatic dissipation properties. The finished product has good mechanical strength and heat resistance. Good impact resistance and chemical corrosion resistance. It will not change its anti-static performance due to the environment, time, and temperature.


Hiner-pack production Waffle Pack (IC tray) is in line with international environmental standards, through the ROHS and SGS third party inspection, such as raw material of the raw material buying from domestic leading manufacturer, incoming inspection and related technology and strictly control the quality during production, quality department must confirm the product 100% qualified before shipment, are sold to domestic and international famous customers over the years, After the use of positive feedback, rich experience in injection molding industry also provides customers with the most appropriate packaging solutions.

Advantage:

1. More than 12 years of export experience

2. With professional engineers and efficient management

3. Short delivery time and good quality

4. Support small batch production in the first batch

5. Professional sales within 24 hours efficient reply

6. The factory has ISO certification, and the products comply with the RoHS standard.

7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, with service and cost performance being well recognized

Service:

1. We have sample stock, which can also help the client to choose which type is suitable for them.
2. We will reply to you at any time if you have questions.
3. Choose a suitable product for clients according to the clients' requirements.
4. After mold customization, free samples will be provided until the customer tests OK, to remove the quality concerns of customers before production.

Technical Parameters:

Brand Hiner-pack Outline Line Size 50.7*50.7*4mm
Model HN2079 Cavity Size 0.7*1.2*0.25mm
Package Type IC Parts Matrix QTY 10*10=100PCS
Material PC Flatness MAX 0.2mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate RoHS/SGS

waffle pack ic chip tray HN2079-1

FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? Is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value, and all samples shipping costs are normally is by collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support doing Ex works, FOB, CNF, CIF, CFR, DDU, DAP, etc., and other incoterms as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, or by express, by mail, post, according to customer order quantity and volume.

waffle pack ic chip tray HN2079-2

Shenzhen Hiner Technology Co.,LTD

Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
  • Annual Revenue: 5,000,000.00-10,000,000.00
  • Employees: 80~100
  • Year Established: 2013