| Price | $0.11-$24 |
| MOQ | 50/500/1000/60K |
| Delivery Time | Stock |
| Brand | LINK-PP |
| Place of Origin | GuangDong, China |
| Certification | UL,RoHS,Reach,ISO |
| Model Number | 1840028-1 |
| Packaging Details | Tray |
| Payment Terms | TT,NET30/60/90 Days |
| Supply Ability | 180K/Month |
| Place of Origin | GuangDong, China | Part Number | 1840028-1 / 1840026-1 |
| Applications | 10/100BASE-T | Packaging Details | Tray |
| Termination | Solder | Model Number | 1840028-1 |
| Mounting Type | Through Hole Mount | Orientation | 90～ Angle (Right) |
| Supply Ability | 180K/Month | Certification | UL,RoHS,Reach,ISO |
| Brand Name | LINK-PP | Payment Terms | TT,NET30/60/90 Days |
| EMI Tabs | Shielded with EMI Finger | Number of Ports | 1X1 and 2 USB A |
| Price | $0.11-$24 | Delivery Time | Stock |
| Minimum Order Quantity | 50/500/1000/60K | Connector Type | Rj45 USB Connector Combo |
| Category | Specification |
|---|---|
| Number of Ports | 1×1 RJ45 + 2× USB A |
| Ethernet Speed | 10/100BASE-T |
| Impedance | 100 Ω |
| Turns Ratio (Chip: Cable) | TX = 1:1, RX = 1:1 |
| Open Circuit Inductance (OCL) | 350 µH Min @ 100 kHz, 0.1 Vrms, 8 mA DC Bias (0°C to 70°C) |
| Insertion Loss (IL) | 1.1 dB Max from 0.5 MHz to 100 MHz |
| Return Loss (RL) | ≥ 18 dB from 0.5 MHz to 30 MHz ≥ [18–20·log(f/30)] dB from 30.1 MHz to 60 MHz ≥ 12 dB from 60.1 MHz to 80 MHz |
| Crosstalk Attenuation | ≥ 35 dB from 5 MHz to 40 MHz ≥ [33–20·log(f/50)] dB from 40.1 MHz to 100 MHz |
| Common Mode Rejection (CMRR) | ≥ 30 dB from 0.5 MHz to 100 MHz |
| Isolation Voltage | Meets IEEE 802.3 Standard |
| Port Configuration | Tab Up RJ45 with USB |
| Height Profile | Standard |
| LED Indicator | Yes (Green/Orange) |
| EMI Tabs | Yes |
| Mounting Type | Through-Hole |
| Operating Temperature | 0°C to +70°C |
| RoHS Compliance | Yes |
Material: Phosphor Bronze, 0.30 mm Thickness
Plating: 1.27 μm Min. Overall Nickel Underplate
Mating Area: Selective Gold Plating (thickness per specification)
Solder Tails: 2.54 μm Min. Matte Tin and/or SAC Solder
2.03 μm Min. Silver over
1.02 μm Min. Nickel underplate over
1.02 μm Copper base
Post-Dipped with: 2.54 μm Min. Matte Tin and/or SAC Solder or Pure Tin
